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Laser Marking|Laser Scribing|Laser Drilling|Laser Cutting|laser ablation :: Home :: Products :: NANO FAKTUR :: HPa Piezo Direct-Drives

NANO FAKTUR
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HPa Piezo Direct-Drives
Features

ˇ´Up to 40% shorter at same strokes
ˇ´Housing is only 12 mm in diameter
ˇ´Isolated connections (current not flowing back via shielding)
ˇ´Versions with 60 V maximum Voltage available
ˇ´Optional strain-gauges (versions HPS) and controllers
ˇ´Versions for high-dynamic use available
ˇ´Hermetically sealed, waterproof, encapsulations possible

 

Detail
Product-Number HPO-a50015 HPO-a50030 HPO-a50050 HPO-a50100 HPO-a50150 Unit
             
Expansion (0..150 V) 15 30 45 90 135 µm
Expansion (-45..180 V) 23 47 72 143 216 µm
Resolution, open loop 0.1 0.2 0.3 0.5 1 nm
Resolution, closed loop 0.2 0.3 0.5 1 1.5 nm
Push/Pull 1400/100 N
Stiffness 70 37 25 12 9 N/µm
Torque, head-piece to body 0.4 Nm
Resonance, unloaded 20 16 12 9 6 kHz
el. Capacitance @ 1V RMS, 1 kHz 1.1 2.2 3.3 6.6 9.9 µF
Overall Length, L 24 34 44 74 104 mm
Mass w/o Wires 15 20 25 40 55 g
Material, Encapsulation, Endpieces stainless steel  
Operating-Temperature -40.. 80 °C
Connection Wire, 1.5 m, w/o Socket a=P, e.g. HPO-P50015  
Connection Wire, 1.5 m, w/ Lemosa a=L, e.g. HPO-L50015
Specification
nanoFaktur HPa (HPO and HPS), encapsulated and preloaded piezo-stack actuators, are easy to handle and immediately employable. HPa exclude the risks, which otherwise come with bare and open stacks. The versions HPS have integrated temperature compensated position-metrology: strain-gage-sensors (SGS) in full-bridge configuration. There are M3/M4 threads in bottom- and top-pieces for facilitating the mounting. The actuators show higher strokes at the same dimensions than competitors´products. Nominal voltages from 60 to 200 V are available. The stacks have no electrical connections to the casings or the shieldings for maximum safety of the users and the realm. The 60 V versions (-30.. 30 V) are ideal for safety-relevant applications, like in medical products. Stacks made of optional loss-reduced (hard) ceramics are perfectly suited for high-dynamic applications. Hermitical sealing, waterproof, encapsulations are available for industry applications.

 

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