Applications
¡´Photovoltaic, e.g. scribing, drilling and cutting of Si-wafer, ablation of conduction or dielectric layers of thin film solar and crystalline Si solar cells
¡´Display, e.g. structuring of conduction layer, sequential lateral crystallization of Si, drilling and cutting of glass screen
¡´Electronics industry, e.g. drilling and cutting of printed circuit boards
¡´Automobile industry, e.g. the manufacture of fuel injection valves
¡´Tool making and mechanical engineering, e.g. 3D rapid prototyping via ablation
¡´Scientific, e.g. pumping of dye laser, pumping of OPO and Ti:Saphire laser, particle imaging velocimetry
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