Laser Marking|Laser Scribing|Laser Drilling|Laser Cutting|laser ablation :: Home :: Products :: Edgewave :: BX-series

Features

●beam quality: M² < 2
●pulse energy up to 8mJ
●pulse length down to 4ns
●peak power up to 1MW
●pulse rep. rate up to 150 kHz
●average power up to 80W
●wavelength 1064, 532, 355, 266nm

Applications

●Photovoltaic, e.g. scribing, drilling and cutting of Si-wafer, ablation of conduction or dielectric layers of thin film solar and crystalline   Si solar cells
●Display, e.g. structuring of conduction layer, cutting of glass screen
●Glass industry, e.g. micro drilling and high throughput subsurface engraving
●Electronics industry, e.g. drilling and cutting of printed circuit boards
●Tool making and mechanical engineering, e.g. 3D rapid prototyping via ablation